عملية التفكيك الكاملة لجهاز Samsung S25 Edge

In this video, we are going to disassemble an extremely light and thin Samsung S25 Edge. Frankly speaking, the novelty of getting this phone is much higher than the other two members in the S25 series. The actual weight is less than 163 grams, and the body is only 5.8mm. The lightness and thinness in the hand are really amazing. However, under the extreme lightness and thinness, does it mean all-round compromise? This is also the purpose of my disassembly. The appearance design has the flavor of the S25 series,

but the Deco design is more like the continuation of Z Fold. The unreal lightness and thinness mentioned at the beginning may be one of the reasons why you impulse to buy it, but I played with it for a few days myself. This lightness and thinness did not bring a better feel. The reason lies in the body size and right-angle frame. Using the naked phone will make you feel more uncomfortable. The experience of wearing a case should be much better. Another point worth complaining about is the opening at the bottom. It is

not centered again. The overall detail design does not have the style of a big manufacturer. There may be problems with the corresponding internal structure, but it can definitely be overcome. The folding phone can be centered even if it is thinner on one side, so why can't Samsung do it? If you change to Apple, it will definitely not be done like this. If you don’t believe it, just wait until the iPhone 17 Air comes out and you will know. Next, let’s get to the point and talk while disassembling. Step 1.

Remove the card tray after turning off the phone. The two cards are placed back to back. The card tray is made of metal + plastic, and there is a dust-proof and waterproof rubber ring on the inside. The outermost baffle of the card tray is the same as the Ultra, and it is not made of titanium alloy like the frame. Step 2: Remove the back cover. After heating, use alcohol and a disassembly piece to cut the glue and separate the back cover. The back cover uses the same Corning Gorilla Victus2 glass as Ultra. On the

inside of the back cover, there are a total of three pieces of buffering materials on the bottom of the Deco and the left side of the body to fill the gap inside the machine. In addition to the regular glue around it, three additional glue spots are made on the upper and lower ends of the Deco to enhance the protective performance of this part. The Deco is fixed to the back cover with glue. A new metal sheet is added on the right as an inner lining. Dust-proof and sealed foam is distributed around the two rear cameras. The

small hole on the left side of the flash is the sound receiving hole for the rear microphone. A new white waterproof and breathable membrane has been added inside to prevent liquid from entering the phone through the sound receiving hole. Through the laser engraving area, you can see that Deco is made of metal. In order to reduce the thickness of the whole machine, the rear cover glass is reduced from 0.6mm of S25 Ultra to less than 0.5mm. The third step is to disassemble the motherboard. The traditional three-stage structure

still has Samsung's unique design style inside. The NFC (or UWB) coil is placed on the right side of the main camera module. The position is reasonable. The middle of the coil corresponds to the core heating area of the motherboard with a heat dissipation film. Because the Chinese version does not use the millimeter wave function, the millimeter wave AiP module on the right is not discharged, leaving only an empty limit groove. Compression foam is added to the coil interface to prevent loosening. The rear microphone sound receiving hole is equipped with anti-sound leakage foam to

optimize the sound receiving quality. The battery position at the bottom is also covered with a heat dissipation film to enhance the heat dissipation capacity of the whole machine. In such a light and thin body, the wireless charging coil is not abandoned. The power is also 15W like Ultra, and wireless recoil is supported at the same time. A closer look shows that the slim body requires the two speaker covers to be hollowed out to make room for the upper and lower microphones to be stacked. Open the coil interface

Remove all screws from the motherboard area and take out the motherboard cover. The cover is made of metal. Turn it inside and you can see that the cover has been compressed into a C-shaped frame due to the extremely limited internal space. There is also a circle of anti-leakage foam around the rear microphone sound receiving hole to ensure the sound reception effect. At this time, you can see the heat dissipation film at the core position, which is connected to the heat dissipation film in the battery area. The

entire area is measured to be around 5700mm². The thickness of the wireless charging coil is 0.33mm, the same as Ultra, compared with 0.18mm of OPPO Find N5, it can be further compressed. Open the antenna interface under the top speaker and take out the top speaker. There is an L-shaped antenna board fixed on the left side of the speaker. All the small components on the small board have been sealed with glue. There is a U-shaped buffer foam on the front camera position to protect the front camera lens group.

Due to the thickness of the body, the top speaker was replaced from Ultra's 1016E to 1016M. It comes from AAC Ruisheng Technology and is filled with N'Bass® acoustic enhancement material. The unit's single unit thickness is reduced from 2.35mm to 1.75mm. It is 0.6mm thinner, but through innovative material application and structural design, the sound performance of the hardware has been improved instead of reduced. My own listening experience is not much different from S25+, but it is still inferior to Ultra.

Now let's take a look at the main part. The whole machine does not use coaxial cables to connect the main and sub-boards. Open the battery interface to cut off the power. Then open all the interfaces on the motherboard. The two rear camera interfaces are fixed on the back of the motherboard. The front camera is still Samsung's usual style. The lens is fixed to the body through structural adhesive. Take out the motherboard and rear camera module, open the two rear camera interfaces, separate the rear cameras, and the two rear cameras are

fixed in a metal roll cage. Please see the picture for detailed information of the camera. The ultra-wide angle is the 1/2.55-inch Sony IMX564 on the S24 Ultra. The aperture of ƒ2.2 remains unchanged. The main camera CMOS is the same 200-megapixel HP2 1/1.3-inch large-bottom sensor as the S25 Ultra. In such a thin body, the aperture and OIS optical image stabilization are not castrated. It was said at the launch conference. In order to fit this flagship main camera into such a thin and light body, the entire lens

module has been redesigned. Turning to the side, you can see that the thickness of the main camera module is very thin, less than 4.4mm in actual measurement. This is nearly 1mm thinner than the main camera of S25 Ultra, and it is also Samsung's smallest high-resolution camera to date. Coming to the motherboard, it adopts a double-layer laminate design. This double-layer laminate is the thinnest of all the mobile phones I have disassembled so far. The PCB comes from South Korea's DAP. The actual thickness of the single-layer board is only 0.35mm, which is only half of the PCB of a regular mobile phone motherboard. The two rear cameras are staggered from the motherboard, so there is no need to worry about heat accumulation during long-

term video recording. No protective measures were found on all the interfaces on the motherboard. Some small components are protected by sealing glue. The interface without material in the upper right corner is the millimeter wave AiP module mentioned earlier. The top microphone and flash are integrated on the front of the motherboard. There is a small L-shaped metal sheet to reinforce the weak position. Note the black rubber pad on the left side of the motherboard. There is white thermal conductive gel remaining on it. Remove the rubber pad and you can see that there is new white thermal gel in the glue injection hole. There is no escape of internal glue (thermal gel). There is a heat dissipation film on the shielding cover on the back of the motherboard. The core position is coated with thermal conductive material. There is a front sensor on the top with integrated ambient light and distance functions. This is also the only

ambient light sensor in the whole machine. The lack of a rear ambient light sensor is very rare at this price. There is also a rear microphone on the right. The sound receiving hole of this rear microphone is hidden at the six o'clock position of the main camera decorative circle. It is very concealed. Tear off the heat dissipation film, clear the thermal conductive material, and blow open the shielding cover. Both RAM and ROM are self-made, with specifications of LPDDR5X+UFS4.0. The SoC under the RAM is the chicken blood version of the S25 Ultra, the Snapdragon 8 Extreme Edition. The frequencies of the CPU

and GPU have been slightly improved. It stands to reason that with such a thin body, the performance release must be discounted. As a result, the actual game performance is not bad. The various data of Genshin Impact are similar to those of S25 Ultra, and even the frame rate of Star Iron is basically the same, but the temperature is indeed a bit out of control. The performance of this game is really surprising. On the other side of the motherboard, there is a rare Qualcomm SDR875 RF transceiver. After layering, you can see that the interlayer is filled with white thermal gel. The amount of this gel is

much larger than that of the Ultra. It completely covers the core heating area, allowing the heat generated by the core to be quickly transferred to the other side of the motherboard through the thermal gel, expanding the heat dissipation area. For the rest of the chip information on the motherboard, please refer to the picture. However, judging from the density of the components, the size of the motherboard seems to be able to be compressed. If the motherboard is made smaller, some space can be freed up for the battery, further increasing the battery capacity and improving the battery life. The blade cuts the structural glue

around the front camera. The front camera CMOS has been used by Samsung Ultra series for several generations. The autofocus function has not been cancelled and the aperture is still ƒ2.2. With the main parameters unchanged, the front camera has also been slimmed down like the main camera. In comparison, the thickness of the front camera of Ultra Edge is less than 2.6mm, while that of Ultra is as much as 3.2mm. In the middle frame motherboard area, the side keys are connected to the motherboard through contacts Dust-proof sealed foam is distributed around the top microphone sound receiving hole and the front camera. The sound receiving hole is equipped with a white waterproof and breathable membrane. The rear camera module is fixed by four limit posts to prevent the lens from

shifting.

The corresponding position of the rear camera interface is affixed with compression foam to prevent the interface from loosening. The buffer foam at the main camera position protects the lens group. A piece of white heat insulation material is affixed in the middle to prevent the heat dissipation film on the middle frame from transferring heat to the main camera and forming unnecessary heat accumulation. The core heating area next to it is hollowed out in a very large size.

A large amount of thermal conductive material

remains at the hollow position.

The heat emitted by the SoC is directly transferred to the VC heat spreader below. This not only avoids the accumulation of thermal resistance caused by the superposition of multiple layers of materials, but also reduces the stacking thickness at this position of the body, killing two birds with one stone. If I remember correctly, this should be the first time that Samsung has hollowed out the core area of the middle frame, allowing the SoC to directly touch the VC heat spreader for heat dissipation.

The VC solution of the S20 Ultra attached to the middle frame does not count. After all, there is a middle frame under the VC. Step 4: Disassemble the sub-board part. Remove all screws in the sub-board area and take out the sub-board cover. The cover is made of metal + plastic The

linear motor of the inner X-axis is fixed to the cover plate through structural adhesive. Buffer foam is attached to both ends of the motor to prevent abnormal noise. It adopts AAC ESA0815 specification (third-generation technology). Different from the ultra-thin version 0815 commonly used in ultra-thin folding machines, this 0815 is built with ESA's third-generation technology platform. The thickness is also increased from 2.4mm of the ultra-thin version 0815 to 2.73mm. The volume exceeds 300mm³.

The

vibration volume is increased by 28%. The overall performance is better than the ultra-thin 0815. The bottom speaker is also changed from 1016E of S25 Ultra to 1016M due to the limitation of the body thickness. All parameters are consistent with the top speaker. N'Bass® acoustic enhancement material will definitely not be absent, making Edge one of the rare top-to-bottom equal models in the current mobile phone market. You see, the machine is thinner, but the motor and dual speakers are configured as much as possible. This may be the stubbornness of a big manufacturer.

Open all the interfaces in the sub-

board area and remove a screw Lift up the small board on the upper left corner to take out the sub-board. The sub-board and the small board on the upper left corner are connected by a flexible FPC. You can see from the microscope that there is no interface or welding trace between the flexible FPC and the sub-board. This form is called a rigid-flexible board. The PCB thickness of the sub-board is only 0.22mm, which is the thinnest of all the mobile phones we have disassembled so far (rigid PCB only). It seems that Samsung has tried its best to make the body within 6mm.

The protection of the

sub-board is slightly higher than that of the main board. Although there are still no protective measures around the interface, most of the small components are protected by glue, and a metal reinforcement sheet is added on the top to strengthen this 0.22mm sub-board. The bottom microphone and SIM card slot are integrated on the sub-board, and the card slot is also protected by buffer foam. The whole machine is equipped with three AAC high-performance digital microphones from Ruisheng Technologies, which

is a regular configuration of flagship phones.

The microphone sound receiving hole adopts an L-shaped anti-fool design. There is no need to worry about damage to the protective structure after misinsertion. Remove the two screws that fix the tail plug cable and take out the cable. The Type-C on the top Due to the thickness of the body, the interface adopts the single tongue solution commonly seen on ultra-thin folding machines. The metal outer surround is cancelled, and there is a dust-proof and waterproof rubber ring on the off the cable. The Type-C on the top Due to the thickness of the body, the interface adopts the single tongue solution commonly seen on ultra-thin folding machines. The metal outer surround is cancelled, and there is a dust-proof and waterproof rubber ring on the inside.

After zooming in, you can see that all the

pins are plated with inert metal to improve the anti-oxidation and corrosion resistance. The interface specifications are consistent with Ultra, and it is also USB3.2 Gen1 with a speed of 5Gbps. DP video output is supported. The DeX desktop mode similar to PC interaction is also retained. In the middle frame sub-board area, the bottom microphone sound receiving hole is equipped with buffer foam + white waterproof breathable membrane. The bottom speaker outlet is protected by a white rubber ring + dustproof net. Like Ultra,

it has passed the

IP68 protection certification for immersion in 1.5 meters of water for 30 minutes. Step 5: Remove the battery. The quick release solution is also consistent with the S25 Ultra. There are handles designed on all four sides of the battery. The battery can be easily removed after all are pulled open. There is no residual glue on the back of the battery and it is very clean. The battery is a single-cell single-interface design with a capacity of only 3900mAh. The manufacturer is Samsung's battery manufacturing company in Vietnam,

using its own SDI battery cell. The projected area of this battery is not small It is 68mm* 82mm in size, which is average for a 6.7-inch phone. You may have guessed that the reason for such a small capacity is the thickness. The battery thickness of conventional candy-bar phones is more than 5mm, and some are even more than 6mm. This is thicker than the Edge, but the Edge battery is only 3.6mm thick. However, due to the use of Samsung's own SDI battery cells, the energy density is only about 758Wh/L calculated through the packaging size, which is still a certain distance from the 800 club. Of course, there is a reason for not using high density. Understanding is long live. The current battery life

is definitely different from that of conventional flagships. My usage scenario cannot last a day. The current maximum battery density has reached 880Wh/L, which can reach 4500mAh at the same volume. There is no charger in the package. Only a CtoC charging cable is given. The wired charging power is only 25W, which is very international. The last step is to remove the screen. After heating, use alcohol and a disassembly piece to cut the glue and separate the screen. Samsung's mobile phone screens are naturally self-produced and self-sold, and the surface is covered with Corning

Gorilla Glass Ceramic 2. Yes, it is glass ceramic The 2K resolution is consistent with the S25 Ultra.

The dimming is still the old tradition of international manufacturers. The 480Hz low-frequency PWM dimming also cancels the anti-reflection feature. The maximum manual full-screen brightness is 490 nits. After turning on the extra brightness, the full-screen brightness reaches 815 nits. The maximum full-screen brightness under strong light excitation is 1375 nits. The brightness is basically on the same level as the S25 Ultra. The back of the screen is fully covered with copper foil. The dedicated interface of the

S Pen electromagnetic layer in the upper right corner has disappeared, which means that this screen does not have a built-in electromagnetic induction layer, reducing the thickness of the screen assembly from 1.2mm of the S25 Ultra to 1mm. Of course, the protective glass also contributes here. The armored glass 2 of the S25 Ultra is measured to be 0.57mm thick, and the thickness has dropped to 0.52mm after Edge was replaced with glass ceramic 2. The single-point ultrasonic fingerprint in the middle has changed the

packaging method compared to Ultra, but the model has not changed, it is still Qualcomm's QFS4008 (3D Sonic Gen 2). The driver board is covered with anti-interference stickers and the bottom uses low-pressure injection molding technology (LIPO packaging technology) The bending area of the cable is wrapped to achieve an ultra-narrow chin. The touch IC is also the same Synaptics S3916T as the Ultra. The middle frame is covered with a heat dissipation film with an area of about 4500mm², which is slightly smaller than the one on the

S25 Ultra. But it is normal after all, the body of the Ultra is also a circle larger. After tearing off the heat dissipation film, there is a stainless steel VC heat spreader underneath, with an area of nearly 3900mm², which is about 600mm² less than the S25 Ultra. The thickness of the VC heat spreader has also been reduced from 0.28mm of the Ultra to 0.26mm. Although the difference of 0.02mm is not large, it is close to the manufacturing limit of the VC heat spreader. In addition, the thickness of the middle frame on both sides of the heat spreader, that is, the battery

compartment position, has also been compressed, from 0.49mm of the Ultra to 0.32mm. You must know that the limit of pure CNC processing is 0.3mm. If you want to go down further, you have to do laser etching again after CNC processing like Huawei MateX6 to get to 0.28mm This also shows that there is actually room for the thickness of Edge to be reduced. It all depends on how to balance the reliability issue. There is a white waterproof and breathable film on the upper right corner of the heat sink. After

tearing it off, you can see the pressure relief hole that balances the air pressure inside and outside the phone. The pressure relief hole leads to this hole on the top of the phone. The hole next to it is the sound receiving hole for the top microphone. The corresponding position of the DDIC (screen display driver chip) at the bottom of the middle frame is affixed with two different colors of buffer foam to improve the screen's drop resistance. If you continue to zoom in, you can see that in order to ensure the strength of the single-tongue C-port, the titanium alloy frame is deliberately extended to the corresponding position of the C-port to enhance the structural reliability of the C-port area. The final middle frame assembly uses the same titanium alloy frame + aluminum

alloy inner frame solution as the S25 Ultra. The two metals are connected together through nano injection molding, but the side buttons are still not made of titanium alloy. This part is the same as the problem in the bottom layout mentioned at the beginning, which is a matter of details. After all, you have sold it for 8,000 yuan, so it’s not too much to ask for a higher level. Okay, that’s it for the disassembly. There are 3 types of 21 screws in the whole machine, and all the screws are back in place Through disassembly, we

can see that if we want to make an extremely thin and light flagship phone, we must not only slim down the front and rear glass panels, middle frame, battery, PCB, camera and heat spreader, but also adjust the Type-C interface, motor, speaker and electromagnetic induction layer. Almost all the components in the phone have been redesigned. After all, thickness is the dimension that affects the internal space the most among the three dimensions. A small change affects the whole body. At the same time, we can also

see that if we want to make a thin and light flagship phone, we must be willing to spend money on heat dissipation. After all, even Samsung, an old antique that has not changed for several years, has to fill the interlayer with thermal conductive gel and then "open a skylight" for the middle frame to let the SoC directly contact the VC heat spreader to achieve higher thermal conductivity. After the overall thinning, if aluminum alloy is used for large structural parts such as the middle frame assembly, the

reliability of the whole machine will inevitably be greatly reduced. Samsung's approach is to use titanium alloy, a metal with a very high mass-to-strength ratio (specific strength) as reinforcement, which improves the overall reliability to a certain extent. Of course, it is unrealistic to expect such a thin body to be strong. We should try to pay attention. In addition, we can also see Being thin and light doesn't necessarily mean an all-round compromise. Samsung S25 Edge has given you as much configuration as possible. Whether it's the main camera, screen or peripherals, they are all on par with the super

cup. Even ultrasonic, wireless charging and dust and water resistance are also arranged. According to the thinking of domestic manufacturers, they will basically use the thickness to give you an excuse. In this regard, Samsung definitely has the style of a big manufacturer. S25 Edge is full of sincerity. As for whether it is worth buying, I think you can wait for iPhone 17 Air or wait for it to jump.