[One R] Process Technology
The Xuanjie O1 leverages TSMC’s cutting-edge second-generation 3nm process technology, delivering unparalleled performance and efficiency in every computation.

[Two R] CPU Architecture
Equipped with ARM’s renowned “1+3+4” tri-cluster architecture:
– A single 3.2GHz Cortex-X3 supercore (or X925, depending on the source) powers demanding tasks with unmatched speed.
– Three mid-range cores operating at 2.5-2.6GHz Cortex-A715 ensure smooth multitasking and gaming experiences.

– Four energy-efficient 2.0GHz Cortex-A510 cores handle background processes while conserving power.
On Geekbench 6, this powerhouse achieves single-core scores ranging from 2200 to 3300 and multi-core scores between 7500 and 8125—placing it shoulder-to-shoulder with Qualcomm’s Snapdragon 8 Gen 2.
[Three R] GPU and Graphics Processing
Featuring an advanced Imagination CXT48-1536 or DXT72-2304 core clocked at 1.3GHz, the GPU delivers a floating-point computing power of up to 4.1TFLOPs. In real-world testing using Genshin Impact, the chip sustains a steady frame rate of 58.3FPS, consuming 0.5W less power than its Snapdragon counterpart.
[Four R] AI Capabilities
Integrated with a self-developed NPU module boasting 40TOPS of AI computing power, the Xuanjie O1 supports the innovative “dual-brain collaborative architecture,” optimizing both performance and energy efficiency. Image recognition occurs in just 0.02 seconds, and nighttime noise reduction is accelerated by an impressive 40%.
[Five R] Communication Technology
Paired with MediaTek’s external 5G baseband, this chip supports next-generation 5G-A networks (with a theoretical peak speed of 10Gbps) and Wi-Fi 7 for lightning-fast connectivity. Additionally, UWB ultra-wideband technology enables centimeter-level device positioning, facilitating seamless features like Xiaomi car keyless unlocking.
[Six R] Ecosystem Integration
Certified for HarmonyOS compatibility, the Xuanjie O1 effortlessly connects with Huawei devices for a unified user experience. It also provides foundational support for the intelligent cockpit of Xiaomi’s SU7/YU7 series vehicles, forming a closed loop that integrates people, vehicles, and homes into one cohesive ecosystem.
[Seven R] Energy Efficiency Optimization
Equipped with Dynamic Voltage Frequency Scaling (DVFS 3.0), the chip reduces power consumption in 5G scenarios by 18%. Meanwhile, silicon photonic interconnect technology boosts memory bandwidth to an astonishing 256GB/s, with latencies as low as 0.8ns, ensuring blazing-fast data transfer and processing speeds.