Dimensity 9500 Processor Leaks: Specs, Performance & Release Date Rumors
The highly anticipated Qualcomm Snapdragon Summit is gearing up for its late September showcase, and in a thrilling head-to-head move, MediaTek is poised to unveil its next-gen flagship platform around the same explosive timeframe.
Tech insider @DigitalChatStation just dropped juicy details about the powerhouse Dimensity 9500. This game-changing SoC will harness TSMC’s cutting-edge N3P process technology for unprecedented performance.
Breaking new ground, the CPU maintains its revolutionary all-big-core design, packing a formidable configuration: 1*Travis + 3*Alto + 4*Gelas cores. Here’s the kicker – Travis and Alto represent ARM’s next-generation X9-series supercores, while Gelas introduces the brand-new A7-series architecture. With a massive 16MB L3 cache and 10MB SLC, plus support for blazing-fast 4x LPDDR5x 10667Mbps memory and 4-lane UFS4.1 storage, this chip is built to dominate.
Early benchmarks are turning heads: the Dimensity 9500 is projected to smash records with a GeekBench 6 single-core score north of 3900 and multi-core performance exceeding 11000. To put this in perspective, its predecessor, the Dimensity 9400, scored 2900+ (single-core) and 9200+ (multi-core) – making this a generational leap worth watching.
Following tradition, the Dimensity 9500 will make its grand entrance powering Vivo’s X300 series, with OPPO’s Find X9 series also confirmed as early adopters. The question is – are you ready to experience MediaTek’s most powerful flagship SoC yet?
Edward Grant 
Ada Stephens 
Bennett Schmidt
The all-big-core design on the Dimensity 9500 sounds insane! If these leaks are accurate, MediaTek might finally give Snapdragon some serious competition this year. Can’t wait to see real-world benchmarks!
Thanks for your enthusiasm! The all-big-core design is indeed a bold move, and if the leaks hold up, it could shake up the flagship SoC race. I’m just as excited to see how it performs in real-world tests—benchmarks should be fascinating. Fingers crossed MediaTek delivers!
Wow, an all-big-core design again? MediaTek is really pushing the boundaries with the Dimensity 9500. Can’t wait to see how it stacks up against Snapdragon’s next flagship in real-world tests! That N3P process should make thermals interesting too.